Overview

R-Theta was established as an electronics component distributor in 1982 and commenced manufacture of heatsinks in 1988, developing processes to meet the demands above and beyond the traditional use of aluminum extrusions, and the mechanical and thermal constraints of an adhesive.

The Fabfin and Dual Baseplate product lines offers significant thermal and mechanical improvements over other methods of joining a multitude of fins to a monolithic heat collecting baseplate(s) by embracing the use of aluminum and/or copper alloys and a patented fabrication process. R-Theta also offers the more traditional options of adhesive, solder or brazed, fin attachment methods.

The Aquasink and Hypercool range of liquid cooled products provide a rugged, flexible solution to cooling compact arrays of high power semiconductors.

Using R-Tools, an interactive, on line, heatsink configurator the design engineer is able to select commonly used semiconductor footprints, interface materials, fan performance and liquid flow rates from a data base and apply them to an engineered aluminum, copper or mixed metal heatsink to satisfy semiconductor safe operating temperatures.

A wide range of standard products for Board Level applications are available as well as high performance greases and other interface materials. Standard heatsinks for DC/DC Converters and Solid State Relays are available from stock.

R-Theta is ISO 9001-2000 registered, supports extensive R & D programs, and continues to distribute electronic components.