Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK (TO-252) package semiconductors
remove the heat indirectly without contacting the device like
traditional thruhole heat sinks. The device and the heat sink are soldered
directly to a modified drain pad creating a thermal transfer path
from package tab to the heat sink.
- 0.64 (0.025) Thick
Copper, Tin Plated
Surface mount heat sink for D2-PAK (TO-263) package
semiconductors
Surface mount heat sink for D2-PAK (TO-263) package
semiconductors remove the heat indirectly without contacting the
device like traditional thru hole heat sinks. The device and the
heat sink are soldered directly to a modified drain pad creating
a thermal transfer path from package tab to the heat sink. -
0.65 (0.026) Thick Copper, Tin Plated
Surface mount heat sink for D3-PAK (TO-268) package
semiconductors
Surface mount heat sink for D3-PAK (TO-268) package
semiconductors remove the heat indirectly without contacting the
device like traditional thru hole heat sinks. The device and the
heat sink are soldered directly to a modified drain pad creating
a thermal transfer path from package tab to the heat sink. - 1.00
(0.039) Thick Copper, Tin Plated
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