R-Theta Thermal Solutions Inc.
R-Tools: Design HeatsinkStock Check StandardsCross Reference & Part # Search
High Performance Heatsink Solutions & Electronic Components
 
 
 

Standards - Interface Materials - Non-Silicone Thermal Compound

 

Polar Non-Silicone Thermal Compoundnon-silicone thermal compound

Polar Non-Silicone - MSDS

Polar RT7102 - RT7180 is grease-like Non-Silicone, non-migrating material heavily impregnated with heat-conductive metal oxides. This formulation provides high thermal conductivity, low bleed and high temperature stability.

Key Features
  • Non-Silicone offers advantages of no creep or migration over wide temperature range.
  • Low Interface Thermal Resistance - (0.03oC-in2/W)
  • High Thermal Conductivity, High dielectric strength.
  • Exceptionally low bleed and evaporation.
  • Meets MIL-C-47113 & MIS-19846 specifications.

Polar RT7203 is grease-like Non-Silicone based reworkable, silver filled thermally and electrically conductive grease. Engineered with specially selected pure silver particles to maximize particle-to-particle contact for most efficient heat transfer and low resistivity.

Key Features
  • Thermally and Electrically Conductive
  • Low Interface Thermal Resistance - (0.005oc-in2/W)
  • High Thermal Conductivity, (7.0 W/moK)
  • Low Resistivity, (< 0.01 Ohm-cm)
  • Exceptionally low bleed and evaporation.
  • Non-Silicone offers advantages of no creep or migration over wide temperature range.

Polar Non-Silicone RT7203 - MSDS

Polar RT7280 is grease-like Non-Silicone, non-migrating material thickened with heat conductive fillers, low bleed and high temperature stability.

Key Features
  • Formulated with low viscosity for easy dispensing and screen printing/stencil, and automated dispensing.
  • Thin bond lines of 1-2 mil.
  • Non-Silicone offers advantages of no creep or migration over wide temperature range.
  • Low Interface Thermal Resistance - (0.03oC-in2/W)
  • High Thermal Conductivity, High dielectric strength.
  • Exceptionally low bleed and evaporation.
  • Meets MIL-C-47113 & MIS-19846 specifications.
Benefits
  • Will not harden, dry out or melt.
  • Will not contaminate solder bath or other devices.
  • Non-toxic.
  • Reworkable and easy to apply, remove and dispense.
Typical Applications
Used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; mounting power resistors; and for any devices where efficient cooling is required in major industries including, electronic (computer, appliance, wireless, etc.) automotive and electrical.
   
 Typical Properties RT7102-RT7180 RT7203 RT7280
 Viscosity: Thixotropic Paste Thixotropic Paste Thixotropic Paste
 Specific Gravity,
 @ 25o C
2.7 4.0 2.4
 Color: White Silver/Gray Blue
 Evaporation,
 @ 200oC, 24 Hrs., %/Wt.
0.3 0.4 0.6
 Thermal Conductivity,
 (ASTM D5470) W/m.oK
1.0 7.0 0.80
 Thermal Resistance
 (oC-in2/W)
0.03 0.005 0.03
 Electrical Properties:      

Dielectric strength (ASTM  D150)
0.05” gap, V/mil

350 N/A 310

 Volume Resistivity
 (ASTM D257)Ohm-cm.

1.8 x 1014 <0.010 1.54 x 1014
 Operating Temperature
 Range
-55oC to 200oC -55oC to 200oC -55oC to 205oC
 Shelf Life 5 Years 5 Years 5 Years
 
   
   
Part Number Description Package Size & Type
RT7102U00000 Non-Silicon Compound 2 Oz. Jar
RT7104U00000 Non-Silicon Compound 4 Oz. Tube
RT7110U00000 Non-Silicon Compound 10 CC Syringe
RT7180U00000 Non-Silicon Compound 5 lb Quart Jar
RT7203U00000 Non-Silicon Compound 3 CC Syringe
RT7280U00000 Non-Silicon Compound  LV 5 lb Quart Jar
 

 
 
Call us for more information at 905-795-0077     Other Ways to Contact Us     Sitemap
Copyright 2007 R-Theta Thermal Solutions Inc.