Overview
R-Theta Thermal Solutions, Inc. offers a broad range of board
level heat sinks for surface mount and thru hole discrete power
semiconductor packages, including JEDEC outlines TO-202, TO-218,
TO-220, TO-247, TO-262, TO-263 (D2PAK) and Multiwatt to mention a
few of the commonly used packages. These heat dissipating
products are available in stamped and extruded aluminum and
include various printed circuit board attachment methods
including surface mount (SMT). Black anodize and other surface
finishes are available.
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Printable Version