Overview
Aquasink Configuration
The rapid evolution of power semiconductors has
necessitated a dynamic, efficient thermal management response
to meet an aggressive host of new design challenges. This new
and exciting domain of Powersinking was initially addressed
by R-Theta Thermal Solutions, Inc. with the introduction of
its patented FabFinŽ line of high performance, air-cooled
heatsinks. Unparalleled as FabFinŽ has proven itself in
delivering maximum thermal dissipation for non-liquid cooled
environments, the time has come to offer dependable thermal
management capability in a liquid cooled format. It is
R-Theta's purpose to provide its customers with the most
advanced Powersinking available within the design community.
With this goal in mind, R-Theta Thermal Solutions, Inc.
introduced Aquasink, patent pending.
Aquasink has been developed to provide the design engineer
with a rugged, high performance, liquid cooled mounting
platform for high power, isolated base semiconductors and
other heat sensitive components. Like FabFinŽ, Aquasink is
based on a broad mechanical envelope allowing for complete
flexibility of design. The capacity of the Aquasink is
further enhanced by the patent pending "flow accelerator"
which increases coolant velocity for any given volumetric
flow rate or reduces volumetric flow rate for any given
velocity. In either mode, the "flow accelerator" enhances
cooling performance.
The technical discussion given in the catalog describes the
various thermal relationships that exist within Aquasink,
which will result in the selecting of certain basic
dimensions for the plate body thickness and pipe diameter. As
always with R-Theta, the design engineer is not restricted to
these sizes. Any length or width of mounting surface may be
specified up to a maximum of 813mm x 610mm respectively.
The heat collecting semiconductor-mounting surface is
fabricated from extruded 6063T5 aluminum alloy. Commercial
grade ASTM B-75 copper pipes of a size to suit given
applications are embedded within the aluminum plate by a
proprietary mechanical process that provides an industry
unique metal to metal bond between the aluminum and copper
that is free of heat impeding glue or bonding epoxy
interface.
The copper pipe location can be specified for practically any
dimension from the datum point. With the exception of the
series configurations, the pipes can be brazed into copper
headers of a size determined by the total number of pipes.
The copper headers are terminated in male pipe thread brass
adapters of a size to suit the header.
We at R-Theta hope that you will find the
technical
discussion comprehensive that provides practical
solutions to your most challenging cooling requirements.
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