Liquid Cooled Heatsinks - Aquasink

Overview

Aquasink was developed to provide the design engineer with a rugged, high performance, liquid cooled mounting platform for high power, isolated base semiconductors and other heat sensitive components. Aquasink is based on a broad mechanical envelope allowing for complete flexibility of design.

Aquasink employs an aluminum body and copper tubes. These tubes are embedded in the aluminum body using a mandreling process that expands the copper tube into intimate contact with the aluminum body creating a very robust construction. A smear of specialty grease at the interface of copper and aluminum prevents the posibility of dissimilar metal corrosion. Heat transfer is equal from both mounting surfaces.

Any length or width of mounting surface may be specified up to a maximum of 813mm x 610mm respectively.

The copper pipe location can be specified for practically any dimension from the datum point. With the exception of the series configurations, the pipes can be brazed into copper headers of a size determined by the total number of pipes. The copper headers are terminated in brass adapters of a size to suit the header.

Materials:

• Copper Tubes - Commercial Grade ASTM B-75
• Baseplate - Typically 6063-T5 but for larger sizes 6061-T6 aluminum alloys

• Wash, ROHS compliant, Trivalent Chrome or Nickel Plating