Overview
Since
the development and introduction of discrete power
semiconductors in the 1950's cooling needs have generally
been provided by attaching them to one-piece aluminum
extrusions with a large surface cooling area.
While many
discrete devices have been converted into multijunction
configurations in a common package requiring high performance
heatsinks discrete devices continue to be developed resulting
in an ongoing demand for extruded heatsinks.
R-Theta Thermal Solutions, Inc. offers a broad range of
extruded sections to cool semiconductors. “See Standard Stocked Extrusion and/or Other Available Extrusions”
By using R-Tools to
optimize your design it is very likely that an existing shape
can be used to meet your needs without going to the expense
of tooling a new shape. |
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