Extrusions

Overview

Since the development and introduction of discrete power semiconductors in the 1950's cooling needs have generally been provided by attaching them to one-piece aluminum extrusions with a large surface cooling area.

Many discrete devices have been converted into multijunction configurations in a common package requiring high performance heatsinks but discrete devices continue to be developed resulting in an ongoing demand for extruded heatsinks.

Aluminum Extrusion heatsinks are the mainstay for cooling medium power semi-conductors. Many shapes are available to fit diverse applications.
Thousands of shapes exist in the marketplace. If you do not find your needs amid our existing offerings, we will tool a new shape to meet your needs with minimum order quantities.

Ferraz Shawmut (formerly R-Theta Thermal Solutions) offers a broad range of extruded sections to cool semiconductors. “See Tooled Extrusions”. By using R-Tools to optimize your design it is very likely that an existing shape can be used to meet your needs without going to the expense of tooling a new shape.

* PERFORMANCE OF ‘COMB’ SHAPES CAN BE MODELED WITHIN R-TOOLS