Overview
R-Theta Thermal Solutions, Inc. offers a broad range of board
level heat sinks for IC (Integrated Circuit) packages such as BGA
and DIP packages, surface mount and thru hole discrete power
semiconductor packages, including JEDEC outlines TO-202, TO-218,
TO-220, TO-247, TO-262, TO-263 (D2PAK) and Multiwatt to mention a
few of the commonly used packages. These heat dissipating
products are available in stamped and extruded aluminum and
include various device and printed circuit board attachment
methods including surface mount (SMT). Black anodize and other
surface finishes are available.
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Printable Version
