Overview
Typically power modules and amplifiers are attached to a heatsink with a multitude of screws together with some form of TIM.
The high thermal barrier at the interface can be eliminated by swaging a multitude of fins into a thick baseplate and then machining the module features and requirements into the baseplate.
Integrated modules can be fabricated using any of the 4 standard fin spacings
FF (8.51 mm), DF (6.86 mm), AF (5.49 mm) or MF (8.43 mm).
Cooling of hot spots can be achieved by using copper fins selectively.
* PERFORMANCE CAN BE MODELED WITHIN R-TOOLS
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