Air Cooled Heatsinks - Fabricated Heatsink Assembly - Swaged FabfinŽ

Any Way You Like It 

Welcome to the imagination challenging potential of Fabfin. The design engineer can now leap beyond the limitations of low ratio one piece aluminum extrusions and the thermal barriers of epoxy assemblies by using Fabfin - the high ratio, high performance, immensely rugged, thermal barrier free, aluminum, copper or mixed metal heatsink assembly. The metal displacement process, developed and patented by R-Theta and referred to as "swaging", creates an interface between the fin and the monolithic baseplate which has no measurable thermal resistance. Because there is no dependence on adhesives in the interface region, the Fabfin principal provides outstanding performance in even the harshest environments. Performance of the patented Fabfin series of heatsinks is limited only by the amount of cooling air which can be delivered to the heatsink's high fin ratio architecture. 

Fabfin is available in many standard configurations but essentially is available in any length, any height, any width, any fin spacing, any fin thickness, any base thickness, fins one side on both sides. The baseplate can be fully or partially populated with fins of the same height or mixed heights. Quantities can be one or millions. Your imagination is our challenge. 

The baseplate can be in either aluminum or copper. 

The fins can be in either aluminum or copper but optimized semiconductor cooling performance can be achieved by mixing fin metals for the lowest weight and cost. 

Optimized fin efficiency can be achieved in aluminum, copper or mixed fin metals by using the patent pending Dual Baseplate assembly that swages two baseplates to a multitude of fins without the use of adhesive. 

Whether your application demands removing heat from Power MOSFET or IGBT Semiconductors, an R.F. transistor, or Laser Diode, or a Thermal Electric Cooler, a Fabfin heatsink solution should be considered. Any dissipation requirement, ranging from 50 watts to 5000 watts, from small TO-220 to large multijunction devices, presents a perfect match for the Fabfin series of high performance heatsinks.