 R-Theta Thermal Solutions, Inc. offers a broad
range of board level heat sinks for surface mount and thru hole
discrete power semiconductor packages, including JEDEC outlines
TO-202, TO-218, TO-220, TO-247, TO-262, TO-263 (D2PAK) and
Multiwatt to mention a few of the commonly used packages. These
heat dissipating products are available in stamped and extruded
aluminum and include various printed circuit board attachment
methods including surface mount (SMT). Black anodize and other
surface finishes are available.
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